AC Impedance Spectroscopy Testing of Electrical Parametric Structures

摘要

Defects in components in ICs which may cause circuit failures during operation of the IC are often difficult to detect during and immediately after fabrication of the IC by DC test methods. A method of testing components to detect such defects using AC Impedance Spectroscopy is disclosed. Data may be analyzed using Nyquist plots and Bode plots. Nyquist plots of typical defect types are disclosed. Components may include MOS transistor gate structures, contacts, vias and metal interconnect lines. Components tested may be contained in integrated circuits or in test circuits. Integrated circuits containing components tested by AC Impedance Spectroscopy may be partially fabricated or deprocessed after fabrication.