| 摘要 |
PROBLEM TO BE SOLVED: To prevent smearing of a substrate, nonuniformity of processing, and a decrease in processing speed in a substrate processing apparatus. SOLUTION: As an embodiment of the present invention, the substrate processing apparatus (1) comprises a processing tank (21) in which the substrate (wafer (2)) is dipped in reserved processing liquid to be processed, a pair of processing liquid supply portions (25, 26) provided to the processing tank (21) to supply the processing liquid toward the substrate (wafer (2)) to form a rising flow of processing liquid in the processing tank (21), discharge ports (34, 35) formed obliquely by directing an upper end of the processing tank (21) outward so as to make the processing liquid flow out, and projections (36, 37), formed protruding inward from side walls (23, 24) of the processing tank (21) at upper parts of the processing tank (21) to split the rising flow of the processing liquid into a flow discharged from the discharge ports (34, 35) and a flow circulated along the side walls (23, 24) of the processing tank (21). COPYRIGHT: (C)2009,JPO&INPIT
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