| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape for wafer processing as an adhesive tape for surface protection that can secure processing precision of a wafer while relieving stress during grinding to some extent in a back grinding process, makes wafer warpage small after the back grinding, and less shrinks even when receiving a thermal history in various heating processes after grinding to give no damage to the wafer having been made thin. SOLUTION: Disclosed is a tape for wafer processing having an intermediate resin layer and an adhesive layer laminated in this order on a base film, wherein the intermediate resin layer has thickness of 20 to 200μm. Further, disclosed is a tape for wafer processing having an intermediate resin layer and an adhesive layer laminated in this order on a base film, which is made of a resin composition containing at least one kind of polymer selected from a group of polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyetherimide, and polyimide. COPYRIGHT: (C)2009,JPO&INPIT |
