| 摘要 |
A method for manufacturing a probe structure is provided to reduce a manufacturing cost by preventing damage of an inspection target in an inspection process. A first etch process is performed to etch partially a first substrate in order to form the substrate including a first opening having a protruded shape. A second etch process is performed to etch the first opening of the first substrate in order to form the first substrate including a second opening having a round shape. The second opening of the first substrate is filled with solder in order to form a solder bump. A connective unit is formed on the second substrate having an electrical wiring. The connective unit(120) is connected with the electrical wiring. The solder bump of the second opening of the first substrate is arranged in an end of the connective unit of the second substrate. The solder bump of the second opening of the first substrate is transcribed in the connective unit of the second substrate.
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