发明名称 |
Conductive structures including titanium-tungsten base layers |
摘要 |
Methods may be provided for forming an electronic device including a substrate, a conductive pad on the substrate, and an insulating layer on the substrate wherein the insulating layer has a via hole therein exposing a portion of the conductive pad. In particular, a conductive structure may be formed on the insulating layer and on the exposed portion of the conductive pad. The conductive structure may include a base layer of titanium-tungsten (TiW) and a conduction layer of at least one of aluminum and/or copper. Moreover, the base layer of the conductive structure may be between the conduction layer and the insulating layer. Related devices are also discussed.
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申请公布号 |
US7550849(B2) |
申请公布日期 |
2009.06.23 |
申请号 |
US20070765648 |
申请日期 |
2007.06.20 |
申请人 |
UNITIVE INTERNATIONAL LIMITED |
发明人 |
MIS J. DANIELS;ZEHNDER DEAN |
分类号 |
H01L23/48;H01L21/60;H01L23/52;H01L23/532 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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