| 摘要 |
Thermal-transfer devices (e.g., cooling devices) are disclosed for optical elements. An exemplary device includes a thermally conductive substrate having a surface. At least one mounting element extends from the surface to a reverse face of the optical element. The mounting element positions the optical element relative to the substrate with a gap between the surface and the reverse face. At least one gas-introduction port is situated relative to the gap. Also included is a gaseous thermal-conduction pathway across the gap between the optical element and the substrate. The thermal-conduction pathway includes flowing gas introduced (e.g., as a thin layer) into the gap by the gas-introduction port.
|
