发明名称 MICRO PIEZORESISTIVE PRESSURE SENSOR AND MANUFACTURING METHOD THEREOF
摘要 A micro semiconductor-type pressure sensor and a manufacturing method thereof are provided. The micro semiconductor-type pressure sensor is implemented by etching a cavity-formation region of a substrate to form a plurality of trenches, oxidizing the plurality of trenches through a thermal oxidation process to form a cavity-formation oxide layer, forming a membrane-formation material layer on upper portions of the cavity-formation oxide layer and the substrate, forming a plurality of etching holes in the membrane-formation material layer, removing the cavity-formation oxide layer through the plurality of etching holes to form a cavity buried in the substrate, forming a membrane reinforcing layer on an upper portion of the membrane-formation material layer to form a membrane for closing the cavity, and forming sensitive films made of a piezoresisive material on an upper portion of the membrane.
申请公布号 WO2009072704(A1) 申请公布日期 2009.06.11
申请号 WO2008KR02233 申请日期 2008.04.21
申请人 ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE;CHOI, CHANG AUCK;JE, CHANG HAN;HWANG, GUNN;KIM, YOUN TAE;JUNG, SUNG HAE;LEE, MYUNG LAE;LEE, SUNG SIK;MOON, SEOK HWAN 发明人 CHOI, CHANG AUCK;JE, CHANG HAN;HWANG, GUNN;KIM, YOUN TAE;JUNG, SUNG HAE;LEE, MYUNG LAE;LEE, SUNG SIK;MOON, SEOK HWAN
分类号 H01L29/84 主分类号 H01L29/84
代理机构 代理人
主权项
地址