发明名称 BLADE LUBRICATION MECHANISM FOR DICING DEVICE, AND BLADE LUBRICATION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To efficiently perform lubrication or cooling at a cutting process point with a very small amount of liquid, by supplying the liquid stably and continuously with no interruption, even if the liquid has a high viscosity, to a blade circumferential side surface by pin point, with the liquid being supplied in such a manner as it is spread in thin on the blade circumferential side surface, so that the liquid easily evaporates and heat is dispersed by evaporation heat, as a result, the frictional heat generated between the blade circumferential side surface and a friction point of workpiece is removed. <P>SOLUTION: The blade lubrication mechanism of a dicing device uses a blade 5 that rotates at a specified rotational speed to cut a workpiece, into individual pieces, which moves relative to the blade 5, and includes a lubrication mechanism 21 which supplies the liquid for lubrication or cooling to a circumferential side surface of the blade 5. The lubrication mechanism 21 includes a capillary structure member 20 which receives the liquid for lubrication or cooling from appropriate liquid supply means 19 and moves the liquid for lubrication or cooling that has been supplied to the circumferential side surface of the blade 5 by capillary phenomenon. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013084811(A) 申请公布日期 2013.05.09
申请号 JP20110224281 申请日期 2011.10.11
申请人 TOKYO SEIMITSU CO LTD 发明人 FUJITA TAKASHI;KOJIMA TSUNEO
分类号 H01L21/301;B24B55/02;B24D5/00 主分类号 H01L21/301
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