MEMS PACKAGE AND METHOD FOR THE PRODUCTION THEREOF

摘要

An MEMS package is proposed, wherein a chip, which has MEMS structures on its top side, is connected to a rigid cover plate and a frame structure, which comprises a polymer, to form a sandwich structure so that a closed cavity which receives the MEMS structures is implemented. Electrical contacts which can be soldered or bonded are disposed on the backside of the chip or on the outer side of the cover plate, which faces away from the chip, the contacts being electrically connected via an electrical connection structure to at least one terminal surface.