发明名称 Low power on-chip global interconnects
摘要 An apparatus including a first circuit, a second circuit and a third circuit. The first circuit may be configured to (a) receive (i) a plurality of input signals and (ii) a clock signal and (b) present (i) a plurality of low-swing differential signals and (ii) a full-swing differential signal. The second circuit may be configured to (a) receive (i) the plurality of low-swing differential signals, (ii) the full-swing differential signal and (iii) the clock signal and (b) present a plurality of output signals. The third circuit may be configured to communicate the plurality of low-swing differential signals and the full-swing differential signal from the first circuit to the second circuit. The third circuit may be further configured to generate a local clock in response to the full-swing differential signal.
申请公布号 US7545205(B2) 申请公布日期 2009.06.09
申请号 US20070924791 申请日期 2007.10.26
申请人 LSI CORPORATION 发明人 TANG ROBIN;WU EPHREM C.
分类号 H01L25/00 主分类号 H01L25/00
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