| 摘要 |
A polishing apparatus and a polishing method are provided to preclude the completion of a polishing work by any one of the polishing head assemblies by making another polishing head to polish polished equal part in case of a polishing head with which polishing work is completed. A polishing apparatus comprises a rotary holding device(3) equipped to rotate a substrate, a plurality of polishing head assembly, a plurality of tape supply and recovery device equipped to recover a polishing tape from the polishing head assembly; and a plurality of moving devices equipped to move the polishing head assembly to the radial direction of the substrate through the rotary holding device. Each of the polishing head assembly consists of a polishing head equipped to compress the polishing tape against the peripheral part of the substrate; and a tilting device equipped to rotate the polishing head with respect to the axis parallel to the tangent line of the substrate. The polishing head consists of a tape feeding device equipped to hold the polishing tape and feed it to the longitudinal direction at the specific speed; and guide rollers(31,32) arranged to guide the moving direction of the polishing tape to the direction perpendicular to the tangent line of the substrate. |
