| 发明名称 |
METHOD AND ARRANGEMENT FOR ENHANCING PROCESS VARIABILITY AND LIFETIME RELIABILITY THROUGH 3D INTEGRATION |
| 摘要 |
A method of enhancing semiconductor chip process variability and lifetime reliability through a three-dimensional (3D) integration applied to electronic packaging. Also provided is an arrangement for implementing the inventive method.
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| 申请公布号 |
US2009144669(A1) |
申请公布日期 |
2009.06.04 |
| 申请号 |
US20070947207 |
申请日期 |
2007.11.29 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BOSE PRADIP;KURSUN EREN;RIVERS JUDE A.;ZYUBAN VICTOR |
| 分类号 |
B25B11/00 |
主分类号 |
B25B11/00 |
| 代理机构 |
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代理人 |
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