发明名称 Flexible Membran für einen Polierkopf und CMP-Vorrichtung mit derselben
摘要 A flexible membrane (100) for a polishing head (4) and a chemical mechanical polishing (CMP) apparatus having the same are provided. The flexible membrane (100) for a polishing head (4) includes a compressing plate (110) having a first face (111) and a second face (112) opposite to the first face. The first face (111) of the compressing plate (110) holds a substrate (S) with a vacuum (VP) provided thereto and compresses the substrate (S) on a polishing pad (3). The second face (112) of the compressing plate (110) is combined with a supporter (620) of the polishing head (4). The second face (112) and the supporter (620) define a space (MZ1) to which the vacuum (VP) for holding the substrate (S) and a first pneumatic pressure (MP1) for compressing the substrate (S) are applied. A dividing member (120,130) combined with the supporter (620) is formed on the second face (112). The dividing member (120,130) divides the space into at least two regions. A pneumatic pressure-introducing portion (125,135) is formed at the dividing member. A second pneumatic pressure is provided to the compressing plate (110) through the pneumatic pressure-introducing (125,135) portion. <IMAGE>
申请公布号 DE602005005864(T2) 申请公布日期 2009.06.04
申请号 DE20056005864T 申请日期 2005.02.03
申请人 SAMSUNG ELECTRONICS CO. LTD. 发明人 PARK, MOO-YONG;KOO, JA-EUNG;HAN, SANG-CHEOL;HONG, DUK-HO
分类号 B24B37/005;B24B37/30;H01L21/304 主分类号 B24B37/005
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