发明名称 |
CIRCUIT MEMBER CONNECTING ADHESIVE AND SEMICONDUCTOR DEVICE |
摘要 |
Provided is a circuit member connecting adhesive for connecting circuit boards facing each other. The circuit member connecting adhesive is composed of a resin composition containing a thermoplastic resin, a thermosetting resin and a curing agent, and metal hydroxide particles dispersed in the composition. The circuit member connecting adhesive has excellent reliability in connection between a semiconductor chip and a substrate, and improves recognition performance of an alignment mark to be used for alignment of a semiconductor chip with a substrate to a level sufficient for practical use. |
申请公布号 |
WO2009069783(A1) |
申请公布日期 |
2009.06.04 |
申请号 |
WO2008JP71727 |
申请日期 |
2008.11.28 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD.;NAGAI, AKIRA;KAWABATA, YASUNORI;KATOGI, SHIGEKI |
发明人 |
NAGAI, AKIRA;KAWABATA, YASUNORI;KATOGI, SHIGEKI |
分类号 |
C09J201/00;C09J11/04;H01L21/60;H05K1/14 |
主分类号 |
C09J201/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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