| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip peeling device capable of efficiently peeling a chip from a sheet without damaging it, a chip peeling method and a chip pickup device. SOLUTION: In a peeling acceleration mechanism 7 for accelerating the peeling of a chip 6 and a sheet 5 by being abutted to the lower surface of the sheet 5 when taking out the chip 6 from the sheet 5 by a take-out nozzle 20 in the chip pickup device, a projecting/sinking member 23 to be abutted to the lower surface is provided so as to be freely projected and sunk relative to a suction surface 22a in the state of bringing the suction surface 22a close to the lower surface of the sheet 5 to such a distance that the vacuum suction force of a suction opening 24 and a suction hole 22b reaches the lower surface of the sheet 5. By executing vacuum suction and bending the sheet 5 downwards in the state of abutting the projecting/sinking member 23 to the lower surface of the sheet 5, the chip 6 and the sheet 5 are peeled using a chip outer edge part positioned near the projecting/sinking member 23 as the origin of peeling. COPYRIGHT: (C)2009,JPO&INPIT |
