| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a flexible wiring board for a tape carrier package that has sufficient flexibility, high insulation reliability, and outstanding thermal resistance, and can obtain high radiation as a package. <P>SOLUTION: The flexible wiring board for a tape carrier package includes an insulation protection layer 9 with a thickness of 3 to 50μm for protecting at least part of a wiring pattern 3 formed on the front surface of an insulation film 1 with a thickness of 5 to 75μm, wherein (1) the thermal conductivity of the insulation film 1 is 0.1 to 3.0 W/mK, and (2) the insulation protection layer 9 has an elastic modulus of 50 to 1,500 MPa in 25°C as a film, and a fracture elongation of 10 to 200%, and includes a cured resin composition containing electrically insulating inorganic particulates having a thermal conductivity of 15 to 500 W/mK, a total of alkali metal ion and halogen ion of 400μg/g or lower at hot water abstraction, and a number average grain diameter of 0.1 to 10μm by a ratio of 25 to 45 volume percent. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
