发明名称 Semiconductor integrated device and manufacturing method for the same
摘要 A first exemplary aspect of an exemplary embodiment of the present invention is a semiconductor integrated device comprising a semiconductor substrate, a first impurity layer of a first conductivity type formed in the semiconductor substrate, a second impurity layer of a second conductivity type formed on the first impurity layer, a first well of the first conductivity type formed on the second impurity layer and supplied with potential from the first impurity layer via an impurity region of the first conductivity type selectively formed in a part of the second impurity layer, and a second well of the second conductivity type formed on the second impurity layer and supplied with potential from the second impurity layer, wherein the impurity concentrations of the first impurity layer and the impurity region are higher than that of the first well, and the impurity concentration of the second impurity layer is higher than that of the second well.
申请公布号 US2009140371(A1) 申请公布日期 2009.06.04
申请号 US20080314011 申请日期 2008.12.02
申请人 NEC ELECTRONICS CORPORATION 发明人 OKAMOTO HITOSHI
分类号 H01L29/02;H01L21/04 主分类号 H01L29/02
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