| 摘要 |
A method for forming a plug is provided to prevent a short circuit and disconnection between metal wiring layers by minimizing a plug recess due to over-etching through topology improvement. An insulating layer(2) having the increased thickness than a required thickness is deposited on a first interconnection(1). The insulating layer is front-etched by the increased thickness, and a contact hole is formed in the insulating layer. A glue layer(4) is formed on a dielectric layer as an etching barrier, and the metal layer for a plug is deposited and the contact hole is buried.
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