| 摘要 |
A radio frequency module is provided to form an antenna as built in without an additional space by forming the antenna into a cavity as wire bonding structure. A radio frequency module comprises a chip component and a passivity element, a cavity(116) is formed at the lower part of a substrate and the antenna(130) is formed at it. A plurality of pin arrays(114) are arranged at the lower part of the substrate, and antenna comprises a conductor pattern and a wire(132) formed in the cavity. A conductor pattern comprises a bonding pad(131) and a lead pattern(133) which is designed in advance. One end of one lead pattern is connected to the bonding pad which the other end of the first wire is connected with while the other end of the lead pattern is connected to the bonding pad in which one end of the second wire is connected.
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