发明名称 Memory module, memory module socket and mainboard using same
摘要 A memory module socket disposed on a principal surface of a mainboard, and adapted to mechanically receive and electrically connect a memory module with a mainboard, the memory module socket including a first unit socket having a plurality of first socket pins adapted to electrically connect a first connector disposed on an edge of the memory module, and a second unit socket having a plurality of second socket pins adapted to electrically connect to a second connector disposed on the memory module orthogonal to the first connector, wherein the memory module as installed in the memory module socket is parallel to the principal surface of the mainboard.
申请公布号 US7540743(B2) 申请公布日期 2009.06.02
申请号 US20070836286 申请日期 2007.08.09
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK SUNG-JOO;KIM KYOUNG-SUN;LEE JUNG-JOON;LEE JEA-EUN
分类号 H01R12/00 主分类号 H01R12/00
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