发明名称 |
Interconnection structure, electronic component and method of manufacturing the same |
摘要 |
An interconnection structure includes an electrically conductive bump, wherein the electrically conductive bump has a metal body having a distal end. The metal body is free of solder. An outermost layer of diffusion solder is positioned on at least regions of the metal body of the electrically conductive bump.
|
申请公布号 |
US7541681(B2) |
申请公布日期 |
2009.06.02 |
申请号 |
US20060381550 |
申请日期 |
2006.05.04 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
OTREMBA RALF |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|