| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition that achieves both high thermal conductivity and adhesive strength, and a cured product made by curing the resin composition, and a thermal conductive material and a thermal conductive member having thermal conductivity and adhesiveness.SOLUTION: A resin composition has a thermosetting resin, a thermally conductive filler, and silane coupling agent (A), where the silane coupling agent (A) is a specific compound in which Ris an alkyl group having 4-10 carbon atoms. There is also provided a cured product made by curing the resin composition.SELECTED DRAWING: None |
