| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device where an antenna is arranged on a semiconductor chip. <P>SOLUTION: The semiconductor device includes a loop antenna 30 and a second insulating layer 15; the loop antenna 30 includes a semiconductor chip 100, including a power circuit section 120 and a transmission/reception circuit section 110, a first insulating layer 10 formed on the semiconductor chip 100, loop-like wiring of which one end is connected to a first terminal T1 and the other end is connected to a second terminal T2, and a capacitor C1 connected between the first terminal T1 and the second terminal T2; the second insulating layer 15 is formed in a shape including a region occupied by the loop antenna between the first insulating layer 10 and the loop antenna 30; and in the semiconductor device 1, the first terminal T1 and the second terminal T2 are connected to the power circuit section 120 and the transmission/reception circuit section 110. <P>COPYRIGHT: (C)2009,JPO&INPIT |
