摘要 |
An apparatus for packaging a tape substrate is provided. The apparatus includes a plurality of robotic arms, a plurality of clamping elements attached to the robotic arms, a memory having a program stored therein, and a control module coupled to the memory to execute the program to perform a packaging process. The packaging process includes clamping a plurality of segments of a tape substrate to the clamping elements, encapsulating a first chip to a first side of a tape substrate to form a first capsule in a first segment, and securing a second segment of the tape substrate adjacent the first segment to a second clamping element. The packing process also includes moving the robotic arms relative to one another to stack the second segment over the first capsule. The first clamping element and second clamping element move independently of each other. |