发明名称 |
POLISHING PAD |
摘要 |
A polishing pad provides excellent optical detection accuracy properties over a broad wavelength range (particularly at the short-wavelength side). A method for manufacturing a semiconductor device includes a process of polishing the surface of a semiconductor wafer with this polishing pad. The polishing pad has a polishing layer containing a polishing region and a light-transmitting region, wherein the light-transmitting region includes a polyurethane resin having an aromatic ring density of 2 wt % or less, and the light transmittance of the light-transmitting region is 30% or more in the overall range of wavelengths of 300 to 400 nm.
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申请公布号 |
US2009137188(A1) |
申请公布日期 |
2009.05.28 |
申请号 |
US20070294391 |
申请日期 |
2007.05.15 |
申请人 |
FUKUDA TAKESHI;HIROSE JUNJI;NAKAI YOSHIYUKI;KIMURA TSUYOSHI |
发明人 |
FUKUDA TAKESHI;HIROSE JUNJI;NAKAI YOSHIYUKI;KIMURA TSUYOSHI |
分类号 |
B24B49/04;B24B37/013;B24B37/20;B24B49/12;B24D11/00;H01L21/304 |
主分类号 |
B24B49/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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