APPARATUS AND METHOD FOR CLEANING A SUBSTRATE

摘要

Provided is an apparatus for cleaning a substrate. The substrate cleaning apparatus includes a spin head for supporting the substrate, a first cleaning unit for cleaning the substrate by a polishing process, and a second cleaning unit for cleaning the substrate by injecting a treating solution. Initially, the polishing pad is in contact with the substrate to polish the substrate and then the polishing pad is removed from contact with the substrate so that the treating solution can be supplied to the substrate to clean the substrate.