发明名称 Three dimensional integrated circuits
摘要 A three-dimensional semiconductor device, comprising: a programmable logic circuit; and a configuration circuit comprising a non planar memory element, wherein: a portion of the memory element is positioned above or below the logic circuit; and an output of the memory element is coupled to the logic circuit to program the logic circuit.
申请公布号 US7538575(B2) 申请公布日期 2009.05.26
申请号 US20080105259 申请日期 2008.04.17
申请人 TIER LOGIC, INC. 发明人 MADURAWE RAMINDA UDAYA
分类号 H03K19/096;G06F7/38;H03K17/693;H03K19/177 主分类号 H03K19/096
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