| 摘要 |
PROBLEM TO BE SOLVED: To provide an anisotropic conductive film as well as its composition which is superior in quality and productivity, in which operability and productivity in a module manufacturing line is improved, and furthermore, which is superior in connecting force and connection resistance also in a short-time circuit connecting process by containing a high-molecular-weight thermoplastic resin and a thermosetting material to provide a dense curing structure. SOLUTION: The semi-thermosetting anisotropic conductive film composition contains (i) the thermoplastic resin of a weight-average molecular weight of 150,000 to 600,000, (ii) a thermosetting material having acrylate or methacrylate functional group of a weight-average molecular weight of 100 to 10,000 or less, (iii) organic peroxide, (iv) a silane coupling agent, and (v) conductive particles. COPYRIGHT: (C)2009,JPO&INPIT |
