| 摘要 |
The present invention relates to A package (50,70) for a microelectronic component, comprising: a carrier element (12) having a first side (16) that comprises conductor lines (14); -a microelectronic component (20) having a first surface (24) and a second surface (23) facing away from the first surface; the microelectronic component with said second surface mounted on said first side and connected to the conductor lines via bonding wires (28); a polymeric encapsulation material (30) encapsulating the bonding wires and exposing a central zone (40) of said first surface (24), the encapsulation material comprising an outer edge (36) at said first side and an inner edge (38) at said first surface; a dam (42,44) abutting to the encapsulation material; wherein the dam (44) comprises a step-shaped surface transition (46) at said first side (16), the surface transition abutting on said outer edge (36). The dam (44) influences the forming of the outer (36) and the inner edge (38) during manufacturing the encapsulation material (30) and enlarges the area of the central zone (40). The present invention also relates to a method of manufacturing such a package for a microelectronic component.
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