| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that a conventional wiring board for incorporating a heat generating electronic component has a limit of heat dissipation characteristics, by using a heat conductive via having larger heat conduction resistance than other heat conductive members. <P>SOLUTION: Disclosed is the wiring board 10 in which a semiconductor element 16 generating heat when driven is incorporated and a plurality of wiring patterns 18 are disposed in multiple layers with insulating layers 22 interposed, wherein a recessed portion is formed such that an opening is formed on a top surface of the wiring board 10 and one surface of the semiconductor element 16 is arranged closely to the bottom surface with portions of the insulating layers 22 interposed, and an other end portion of a heat dissipation member 12 which is inserted into the recessed portion and of which an end portion is abutted on the bottom surface of the recessed portion, is exposed on the top surface of the wiring board 10. <P>COPYRIGHT: (C)2009,JPO&INPIT |
