| 摘要 |
<p>Adhesion promoter composition (C1) comprises an adhesion promoter and 40-99 wt.% of a liquid carrier with a boiling point above 250[deg] C or a vapor pressure below 0.1 mbar at 20[deg] C. Independent claims are also included for: (1) glueing or sealing method comprising applying C1 to to a first substrate (S1), applying an adhesive or sealant to C1 on S1 and contacting the adhesive or sealant with a second substrate (S2); or applying C1 to S1, applying an adhesive or sealant to S2 and contacting the adhesive or sealant with C1 on S1; or applying C1 to S1 and applying an adhesive or sealant between S1 and S2; (2) article produced by the above method.</p> |
