PACKAGE FOR HOUSING ELECTRONIC ELEMENT, AND LIGHT-EMITTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a package, capable of preventing problems such as damage, deformed crack or crack in dividing a frame sheet into individual packages even when the package downsized in accordance with demands of integration is manufactured using the multiple patterning.

SOLUTION: The method of manufacturing the package has at least an adhering step of adhering a plurality of substrates to a frame sheet having a plurality of frames formed thereon; and a splitting step of splitting the frame sheet into frames each having substrates adhering thereon after the adhering step and acquiring individual packages.

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