| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device improved in reliability of electrical connection between a substrate and an electronic element; and a method of manufacturing the same. <P>SOLUTION: This electronic device 1 includes: the substrate 2 having at least one pad 3; the electronic element 6 having at least one bump 8 electrically connected to the at least one pad 3 of the substrate 2 and mounted on the substrate 2 by flip chip bonding; a conductive resin 4 electrically connecting the pads 3 to the bumps 8; and an insulating sheet 5 interposed between the substrate 3 and the electronic element 6. The substrate 2 has a recessed part 2a for each pad 3 on a surface opposite to the electronic element 6. The pad 3 is formed on at least a bottom part of the recessed part 2a. The conductive resin 4 is filled on the pads 3 and in the recessed parts 2a. A sheet 5 has a through-hole 5a of which the opening area is smaller than that of the recessed part 2a on a bump 8 basis. The bump 8 is inserted into the through-hole 5a by contacting the inner wall of the through-hole 5a, and electrically connected to the pad 3 through the conductive resin 4 without directly contacting the pad. <P>COPYRIGHT: (C)2009,JPO&INPIT |
