Electroless Copper Plating Solution for EMI Shielding Material and procee of manufacturing product,申请号KR20070082123-传众专利搜索

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发明名称	Electroless Copper Plating Solution for EMI Shielding Material and procee of manufacturing product
摘要
申请公布号	KR100897383(B1)	申请公布日期	2009.05.14
申请号	KR20070082123	申请日期	2007.08.16
申请人		发明人
分类号	C23C18/38	主分类号	C23C18/38
代理机构		代理人
主权项
地址

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