| 摘要 |
PROBLEM TO BE SOLVED: To provide a carrier frame which has a simple structure, can inexpensively be produced and can prevent dust from being generated during transfer, and to provide a method for production of an electronic component. SOLUTION: A frame body 5 is composed of a base layer material 3, a frame layer material 2, and a positioning layer material 1 having a plurality of openings 1a each housing the electronic component. A spring layer material 4 is attached to a hollow portion 6 between the positioning layer material 1 and the base layer material 3 enclosed by the frame layer material 2. A small spring part 4b which imparts an elastic force to clamp the electronic component between the opening end of the positioning layer material 1 and itself is formed integrally with the spring layer material 4 in each opening 4a thereof. A large spring part 4e contacting the inner surface of the frame layer material 2 in the attachment state to give an elastic force along the lengthwise direction is integrally formed with the one end of the spring layer material 4 in the lengthwise direction. In this construction all the electronic components are totally positioned only by the spring layer material 4. COPYRIGHT: (C)2009,JPO&INPIT |
