发明名称 WIRING CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring circuit board which is excellent in the precision of the arrangement of second wiring, and can stabilize impedance in first wiring and the second wiring. SOLUTION: The wiring circuit board is constituted in such a manner that a base insulating layer 3 is formed on a metal support substrate 2, first wiring 4 (first lead wiring 4R and first light wiring 4W) is formed on the base insulating layer 3, an intermediate insulating layer 5 is formed so as to cover the first wiring 4 on the base insulating layer 3, second wiring 6 (second lead wiring 6R and second light wiring 6W) is formed having a width narrower than that of the first wiring 4 in which face-to-face arrangement is carried out to the first wiring 4 in a thickness direction on the intermediate insulating layer 5, and a cover insulating layer 7 is formed so as to cover the second wiring 6. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009099687(A) 申请公布日期 2009.05.07
申请号 JP20070268292 申请日期 2007.10.15
申请人 NITTO DENKO CORP 发明人 KAMEI KATSUTOSHI;OSAWA TETSUYA;HO VOON YEE
分类号 H05K1/02;G11B5/60;G11B21/21 主分类号 H05K1/02
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