| 摘要 |
PROBLEM TO BE SOLVED: To provide a piezoelectric element housing package which can prevent the occurrence of cracks due to thermal stress which concentrates at through-holes prepared in a ceramic base, and can form an inexpensive piezoelectric device. SOLUTION: The piezoelectric element housing package 10 accommodates a piezoelectric element 12 in a space 17 which is formed by: the ceramic base 11 of a nearly flat plate shape which prepares a first through-hole 14 which has a predetermined inner diameter, and opens in an upper surface, and a second through-hole 15 which has an inner diameter larger than that of the first through-hole, and opens to a bottom surface, while prepares a mounting unit 13 for joining the piezoelectric element 12 on the upper surface; and a frame body 16 of a window frame shape prepared in an upper surface perimeter part. While the package has a first metallized film 20 in a step difference unit 19 between the first through-hole 14 and the second through-hole, and a second metallized film 21 on a wall face of the second through-hole 15 connecting to the first metallized film; it has a third metallized film 22 which is connected to the first metallized film 20, and extended to a middle of the wall face of the first through-hole 14. COPYRIGHT: (C)2009,JPO&INPIT
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