发明名称 LOOP HEAT PIPE AND ELECTRONIC EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a loop heat pipe more stabilizing motion. <P>SOLUTION: This loop heat pipe 16 including: a vessel 22 having a flow path 21 formed in a looped shape and; a working fluid 23 sealed in the vessel 22, further includes: a first wick 61 provided at least in a heat generating component opposing area in an evaporation part 31; and a second wick 62 adjacent to the first wick 61 from the side of a liquid return pipe 34. The vessel 22 has: a first wall portion 51 facing a heat generating component 12; and a second wall portion 52 opposed to the first wall 51 with a space as the flow path 21 from the first wall portion 51. The first wick 61 has: a first portion 61a provided in the first wall 51; and a second portion 61b provided in the second wall portion 52 with space S from the first portion 61a. The second wick 62 is provided over the entire region between the first wall 51 and the second wall 52. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009097757(A) 申请公布日期 2009.05.07
申请号 JP20070268096 申请日期 2007.10.15
申请人 TOSHIBA CORP 发明人 TOMIOKA KENTARO
分类号 F28D15/02;H01L23/427;H05K7/20 主分类号 F28D15/02
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