| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in soldering resistance and a semiconductor device. <P>SOLUTION: The epoxy resin composition used for semiconductor encapsulation comprises (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) an organic compound having a sulfur atom and an alcoholic hydroxyl group, wherein the sulfur atom forms a monosulfide bond and the organic compound does not have a nitrogen-containing heterocycle. The semiconductor device is characterized in that a semiconductor element is encapsulated with a cured product of the epoxy resin composition. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
