SEMICONDUCTOR PACKAGE AND ITS PRODUCTION METHOD

摘要

PROBLEM TO BE SOLVED: To provide a small semiconductor package that can easily include a helical coil (inductance) in an IC mounted substrate.

SOLUTION: The semiconductor package includes a coil-forming component structure in which two or more primary horizontal interconnects are formed on a substrate and two or more vertical interconnects are connected to both ends of each of two or more secondary horizontal interconnects of the primary horizontal interconnects. Ends of the vertical interconnects are each located on both ends of each primary horizontal interconnects, so that the coil forming component structure is fixed onto the substrate, thereby being electrically connected. This will enable the two or more primary and secondary horizontal interconnects and vertical interconnects to be connected in series to form one helical coil.

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