| 摘要 |
PROBLEM TO BE SOLVED: To efficiently return mold releasing pins 22/23 (an ejector plate 26) to the returning positions thereof in a mold 1 (an upper mold 2, a lower mold 3 and an intermediate mold 4) using a top gate 9. SOLUTION: At first, a heated and melted resin material 13 is injected and packed into a cavity 7, thus an electronic component 6 fitted to a substrate 5 is sealed and molded into a resin molded body 14, so as to form a molding 15 (the resin molded body 14 and the substrate 5). Next, when an ejector plate 26 energized toward a returning direction (lower direction) is pushed to a projecting direction (upper direction) by a pushing member 34 via a pushing tool 32, the mold releasing pins 22/23 fixed to the ejector plate 26 are guided by a return pin 28, and thus the molding 15 is projected by the mold releasing pins 22/23, so as to be released. Further, upon the defect of sliding in the mold releasing pins 22/23, the mold releasing pins 22/23 can be returned to the returning positions by pushing the return pin 28 by the upper mold 2. COPYRIGHT: (C)2009,JPO&INPIT |
