发明名称 SEMICONDUCTOR MOUNTING METHOD
摘要 PROBLEM TO BE SOLVED: To achieve reliable high-density mounting by achieving bonding with a gold-tin flip chip which is low in load and stable by devising the electrode structure of a package substrate. SOLUTION: In a semiconductor mounting method of flip-chip mounting a semiconductor chip on a mounting substrate and fixing the semiconductor chip and mounting substrate with a resin, respective electrode portions of the substrate side coming into contact with respective bumps of the semiconductor chip side are separated in two portions and hole drilling of a conic shape is carried out from the upper portion, and the respective bumps come into contact with the respective electrode portions at conic shape portions thereof. Then alloy layers are formed between bump side surfaces and inner portions of the electrode holes to achieve bonding with a low load since gold bump tips need not be crushed, and the bump side surfaces and the inner portions of the electrode holes are rubbed against each other to peel oxide films of tin plating, thereby forming the more satisfactory alloy layers. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009099647(A) 申请公布日期 2009.05.07
申请号 JP20070267517 申请日期 2007.10.15
申请人 YOKOGAWA ELECTRIC CORP 发明人 KUSAYANAGI NAOYA
分类号 H01L21/60;H05K3/34 主分类号 H01L21/60
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