发明名称 |
ETCHING METHOD AND METHOD FOR MANUFACTURING OPTICAL/ELECTRONIC DEVICE USING THE SAME |
摘要 |
<p>Disclosed is a semiconductor etching method which enables to easily etch a semiconductor layer that is composed of, for example, a hardly etchable group III-V nitride semiconductor by a relatively simple process. This etching method is characterized by comprising a step for forming a metal fluoride layer (3) on the surface of a base (1, 2) as at least a part of an etching mask, a step for processing the metal fluoride layer with a liquid, and a step for etching the base using the metal fluoride layer as a mask.</p> |
申请公布号 |
WO2009057764(A1) |
申请公布日期 |
2009.05.07 |
申请号 |
WO2008JP69920 |
申请日期 |
2008.10.31 |
申请人 |
MITSUBISHI CHEMICAL CORPORATION;HORIE, HIDEYOSHI;FUKADA, TAKASHI |
发明人 |
HORIE, HIDEYOSHI;FUKADA, TAKASHI |
分类号 |
H01L21/3065;H01L21/306;H01L33/00 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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