发明名称 ETCHING METHOD AND METHOD FOR MANUFACTURING OPTICAL/ELECTRONIC DEVICE USING THE SAME
摘要 <p>Disclosed is a semiconductor etching method which enables to easily etch a semiconductor layer that is composed of, for example, a hardly etchable group III-V nitride semiconductor by a relatively simple process. This etching method is characterized by comprising a step for forming a metal fluoride layer (3) on the surface of a base (1, 2) as at least a part of an etching mask, a step for processing the metal fluoride layer with a liquid, and a step for etching the base using the metal fluoride layer as a mask.</p>
申请公布号 WO2009057764(A1) 申请公布日期 2009.05.07
申请号 WO2008JP69920 申请日期 2008.10.31
申请人 MITSUBISHI CHEMICAL CORPORATION;HORIE, HIDEYOSHI;FUKADA, TAKASHI 发明人 HORIE, HIDEYOSHI;FUKADA, TAKASHI
分类号 H01L21/3065;H01L21/306;H01L33/00 主分类号 H01L21/3065
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