发明名称 |
Image sensing devices and methods for fabricating the same |
摘要 |
Image sensing devices and methods for fabricating the same are provided. An exemplary image sensing device includes a first substrate having a first side and a second side opposing each other. A plurality of image sensing elements is formed in the first substrate at the first side. A conductive via is formed through the first substrate, having a first surface exposed by the first substrate at the first side and a second surface exposed by the first substrate at the second side. A conductive pad overlies the conductive via at the first side and is electrically connecting the image sensing elements. A conductive layer overlies the conductive via at the second side and electrically connects with the conductive pad. A conductive bump is formed over a portion of the conductive layer. A second substrate is bonded with the first substrate at the first side.
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申请公布号 |
US7528420(B2) |
申请公布日期 |
2009.05.05 |
申请号 |
US20070752427 |
申请日期 |
2007.05.23 |
申请人 |
VISERA TECHNOLOGIES COMPANY LIMITED |
发明人 |
WENG JUI-PENG;LIN TZU-HAN;ZUNG PAI-CHUN PETER |
分类号 |
H01L29/22;H01L27/148;H01L27/15;H01L29/227;H01L29/267;H01L29/417;H01L29/74;H01L29/768;H01L31/00;H01L31/0203;H01L31/111;H01L31/12;H01L33/00 |
主分类号 |
H01L29/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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