发明名称 LIGHT-EMITTING DIODE CHIP AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a light-emitting diode chip which can be driven with a high voltage and a low current and can dissipate a heat source, and the manufacturing method thereof. <P>SOLUTION: The light-emitting diode chip includes at least one first electrode, at least one second electrode, and at least one light-emitting layer installed between the first electrode and the second electrode. The first electrode is electrically connected with the second electrode by the light-emitting layer, and when a voltage difference is supplied between the first electrode and the second electrode, the light-emitting layer generates a light beam. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009094459(A) 申请公布日期 2009.04.30
申请号 JP20080130710 申请日期 2008.05.19
申请人 TAIDA ELECTRONIC IND CO LTD 发明人 TU SHENG-HAN;KYO KOKUKUN;CHANG SHII-HOW;LIN KUN-YUEH
分类号 H01L33/08;H01L33/12;H01L33/20;H01L33/28;H01L33/32;H01L33/38 主分类号 H01L33/08
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