| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing a bonding layer from peeling or cracking owing to a heat cycle without lowering electric power feeding efficiency. <P>SOLUTION: In the semiconductor device having the bonding layer 26 electrically connecting a semiconductor element 27 and a wiring board 25 to each other, the wiring board 25 has a recessed portion 25a wherein the semiconductor element 27 can be stored, the semiconductor element 27 is stacked on an internal bottom of the recessed portion 25a through the bonding layer 26 interposed therebetween, and the bonding layer 26 is formed of a conductive material capable of plastically deforming above a predetermined temperature and below the highest in-use temperature. <P>COPYRIGHT: (C)2009,JPO&INPIT |
