| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting device capable of raising a reliability to a temperature cycle in the case of using the light emitting device by mounting the light emitting device in a wiring substrate consisting of a metal-based printed wiring board. <P>SOLUTION: The light emitting device is equipped with: an LED chip 1; a mounting board 2 consisting of a multilayer ceramic substrate in which the LED chip 1 is mounted at one front surface side thereof; and a metal plate 25 buried under the other front surface side of the mounting board 2, in which a perimeter line in a projection view is positioned outside a perimeter line of the LED chip 1. The metal plate 25 projects from a plane including the other front surface of the mounting board 2. When the light emitting device is mounted in a wiring substrate 7 consisting of the metal-based printed wiring board, the metal plate 25 is bonded to conductor patterns 75 of the wiring substrate 7 through a combiner 85 consisting of solder, and consequently the metal plate 25 is thermally bonded to the conductor patterns 75. <P>COPYRIGHT: (C)2009,JPO&INPIT |
