SELF-ALIGNMENT APPARATUS AND METHOD FOR SELF-ALIGNMENT DURING CHIP PACKAGE PROCESS BY USING MAGNETIC FIELD

摘要

A magnetic self-alignment apparatus and a method for self-alignment between a chip (9) and a substrate (7) during chip packaging are provided to reduce the cost of self-alignment. The magnetic self-alignment apparatus includes a magnetic device (1), a substrate conveyor (3) and a chip conveyor (8). The magnetic device (1) includes one or several set of magnetic poles (2) arranged in one-dimension or two-dimensions. Each of the set of magnetic poles (2) comprises two or three poles, so as to the magnetic field is provided for self-aligning the bonding points of the chip (9) and the corresponding bonding points of the substrate (7). The substrate conveyor (3) includes two roll shafts (6), a conveyor belt (5) and a stepping controller (4). The chip conveyor (8) is located under the substrate conveyor (3).