| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper foil attached with a resin, without containing a halogen atom, which has a high bonding strength of a copper foil layer with a resin layer, exhibits a high flame retardant property and exhibits reliability as a material of a printed wiring board. SOLUTION: This copper foil attached with the resin has a resin composition consisting of (A) 100 pts.mass non-halogen-based epoxy resin, (B) 10 to 100 pts.mass polymer component, (C) 20 to 80 pts.mass amino group-containing phosphoric acid ester expressed by general formula (1) [wherein, X<SP>1</SP>to X<SP>5</SP>may be each independently the same or different H or a 1-3C alkyl] and (D) 5 to 80 pts.mass diamine compound other than the amino group-containing phosphoric acid ester, as the resin layer. COPYRIGHT: (C)2009,JPO&INPIT |
