| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chemical-mechanical polishing pad with a long product life by which a damage on a polishing layer during chemical-mechanical polishing is suppressed, and a chemical-mechanical polishing method using the pad. <P>SOLUTION: The chemical-mechanical polishing pad 10 is fixed on a polishing plate 13 of a polishing device, and includes the polishing layer 11 and a cushioning layer 14 arranged between the polishing layer 11 and the polishing device surface plate. The cushioning layer 14 is provided with a through hole 20 in an area including the center part of the polishing layer 11. <P>COPYRIGHT: (C)2009,JPO&INPIT |
